Name |
¡@ |
Silicon Nitride |
¡@ |
MSN |
Composition |
¡@ |
Si3N4 |
General Properties |
Color |
Gray |
Bulk Density(g/cm3) |
3.2 |
Water Adsorption Ratio(%) |
0 |
Mechanical Properties |
Bending Strength (MPa) |
880 |
Compressive Strength (MPa) |
2940 |
Young's Modulus (GPa) |
290 |
Poisson's Ratio |
0.28 |
Hardness (GPA) |
16 |
Electrical Properties |
Volume Resistivity [RT] (£[¡Ecm) |
- |
[500¢J] (£[¡Ecm) |
- |
Dielectric Constand [1MHz] |
- |
Dielectric Tangent [1MHz] |
- |
Dielectric Strength (kV/mm) |
- |
Theremal
Properties |
Max. Useable Temperature (¢J) |
1200 |
Thermal Expansion [RT-200¢J] (/¢J) |
- |
[RT-400¢J] (/¢J) |
- |
[RT-600¢J] (/¢J) |
- |
[RT-800¢J] (/¢J) |
3.2x10-6 |
Thermal Conductivity [RT] (W/m¡Ek) |
25 |
[400¢J] (W/m¡Ek) |
- |
[800¢J] (W/m¡Ek) |
- |
Specific Heat [RT] (kj/kg¡Ek) |
- |
[400¢J] (kj/kg¡Ek) |
- |
[800¢J] (kj/kg¡Ek) |
- |
Thermal Shock Strength (¢J) |
700 |
Remarks |
|
production outsourcing |